An open, beginner-friendly book that follows one silicon wafer from sand, through the fab, test and packaging, until it becomes a chip. It skips heavy physics and focuses on process flow, terminology and know-how from the fab floor, with term boxes and know-how boxes in every chapter. No background in semiconductor physics is needed.
目錄 · Contents · 目次 · 목차
第 0 部 開始之前 · Part 0: Before You Start · 第 0 部 はじめる前に · 제0부 시작하기 전에
第 1 部 基礎 · Part 1: Fundamentals · 第 1 部 基礎 · 제1부 기초
第 2 部 製程模組 · Part 2: Process Modules · 第 2 部 プロセスモジュール · 제2부 공정 모듈
第 3 部 製程整合 · Part 3: Process Integration · 第 3 部 プロセスインテグレーション · 제3부 공정 통합
第 4 部 品質與良率 · Part 4: Quality and Yield · 第 4 部 品質と歩留まり · 제4부 품질과 수율
第 5 部 後段：測試與封裝 · Part 5: Back End — Test and Packaging · 第 5 部 後工程：テストとパッケージング · 제5부 후공정: 테스트와 패키징
第 6 部 走出晶圓廠 · Part 6: Beyond the Fab · 第 6 部 ファブの外へ · 제6부 팹 밖으로
附錄 · Appendices · 付録 · 부록
Reading paths
| Path |
Chapters |
| 🚀 Quick overview |
0, 1, 11, 14 |
| 💻 Software and firmware engineers |
0, 2, 11, 13, 14, 22, 23, 24 |
| 🏭 Joining the industry |
The whole book, especially 1, 11, 15–18 and Appendix B |
| 📦 Packaging and test |
0, 11, 19–22 |
Contributing
The original text is written in Traditional Chinese, and the other languages are translations of it. If this book helps you, please give it a ⭐ star so that more people can find it.
Disclaimer
This book is based on public information and general industry knowledge. It contains no confidential information, process parameters or internal procedures of any company, and it is not affiliated with any semiconductor company. Most numbers are orders of magnitude or approximate values; actual values vary by process, product and company.
License
The text and images are licensed under CC BY-NC-SA 4.0. You may share, adapt and translate them for non-commercial purposes, as long as you give credit and share your work under the same license.
